The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 21, 2020

Filed:

Jun. 20, 2017
Applicant:

Kla-tencor Corporation, Milpitas, CA (US);

Inventors:

Kaushik Sah, Kessel Lo, BE;

Thomas Krah, Friedberg, DE;

Shifang Li, Pleasanton, CA (US);

Heiko Eisenbach, Elz, DE;

Moritz Stoerring, Brussels, BE;

Assignee:

KLA-Tencor Corporation, Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 9/00 (2006.01); G06T 7/00 (2017.01); G06T 7/73 (2017.01); H01L 21/66 (2006.01); G06T 7/13 (2017.01); G01B 11/00 (2006.01); G01B 11/24 (2006.01); G06T 7/60 (2017.01); H01L 21/306 (2006.01);
U.S. Cl.
CPC ...
G06T 7/0004 (2013.01); G01B 11/002 (2013.01); G01B 11/2433 (2013.01); G06T 7/13 (2017.01); G06T 7/60 (2013.01); G06T 7/73 (2017.01); H01L 22/12 (2013.01); G01B 2210/56 (2013.01); G06T 2207/20061 (2013.01); G06T 2207/30148 (2013.01); H01L 21/30625 (2013.01); H01L 22/20 (2013.01);
Abstract

Wafer edge profile images are analyzed at locations around a bonded wafer, which may have a top wafer and a carrier wafer. An offset curve is generated based on the wafer edge profile images. Displacement of the top wafer to the carrier wafer is determined based on the offset curve. The wafer edge profile images may be generated at multiple locations around the wafer. The wafer edge profile images may be shadowgram images. A system to determine displacement of the top wafer to the carrier wafer can include an imaging system connected with a controller.


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