Company Filing History:
Years Active: 2020
Title: Heiko Eisenbach: Innovator in Wafer Metrology
Introduction
Heiko Eisenbach is a notable inventor based in Elz, Germany. He has made significant contributions to the field of wafer metrology, particularly through his innovative patent. His work focuses on enhancing the accuracy of measurements in semiconductor manufacturing.
Latest Patents
Eisenbach holds a patent for a method titled "Bonded Wafer Metrology." This invention involves analyzing wafer edge profile images at various locations around a bonded wafer, which consists of a top wafer and a carrier wafer. An offset curve is generated based on these images, allowing for the determination of the displacement of the top wafer relative to the carrier wafer. The images may be shadowgram images, and the system includes an imaging system connected to a controller. He has 1 patent to his name.
Career Highlights
Heiko Eisenbach is associated with Kla Tencor Corporation, a company known for its advanced semiconductor manufacturing equipment. His role at the company has allowed him to apply his expertise in wafer metrology and contribute to the development of innovative solutions in the industry.
Collaborations
Eisenbach has worked alongside talented colleagues, including Kaushik Sah and Thomas Krah. Their collaborative efforts have furthered advancements in the field of semiconductor technology.
Conclusion
Heiko Eisenbach's contributions to wafer metrology exemplify the importance of innovation in the semiconductor industry. His patent and work at Kla Tencor Corporation highlight his role as a key figure in advancing measurement techniques.