The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 2019
Filed:
Jan. 24, 2018
Applicant:
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Inventors:
Chi-Hsi Wu, Hsinchu, TW;
Wensen Hung, Hsinchu County, TW;
Tsung-Shu Lin, New Taipei, TW;
Shih-Chang Ku, Taipei, TW;
Tsung-Yu Chen, Hsinchu, TW;
Hung-Chi Li, Taipei, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/367 (2006.01); H01L 21/48 (2006.01); H01L 25/065 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); H01L 21/4882 (2013.01); H01L 25/0657 (2013.01); H01L 23/3733 (2013.01); H01L 2225/06568 (2013.01); H01L 2225/06589 (2013.01);
Abstract
The present disclosure provides a semiconductor structure including a substrate, a first die over the substrate, a second die over the first die, a heat spreader having a sidewall facing toward and proximal to a sidewall of the first die, and a thermal interface material (TIM) between the sidewall of the first die and the sidewall of the heat spreader. A thermal conductivity of the heat spreader is higher than a thermal conductivity of the TIM.