The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 16, 2019

Filed:

Apr. 19, 2017
Applicant:

Tokyo Electron Limited, Minato-ku, Tokyo, JP;

Inventors:

Akiteru Ko, Schenectady, NY (US);

Angelique Raley, Halfmoon, NY (US);

Sophie Thibaut, Troy, NV (US);

Satoru Nakamura, Albany, NY (US);

Nihar Mohanty, Clifton Park, NY (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/033 (2006.01); H01L 21/02 (2006.01); H01L 21/027 (2006.01); H01L 21/311 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0337 (2013.01); H01L 21/0228 (2013.01); H01L 21/0276 (2013.01); H01L 21/02164 (2013.01); H01L 21/02274 (2013.01); H01L 21/0332 (2013.01); H01L 21/0335 (2013.01); H01L 21/31116 (2013.01); H01L 21/31138 (2013.01); H01L 22/12 (2013.01); H01L 22/20 (2013.01); H01L 22/26 (2013.01);
Abstract

Provided is a method of patterning spacers, the method comprising: providing an initial patterned structure in a substrate in a processing chamber, the initial patterned structure comprising an organic mandrel and an underlying layer; exposing the patterned structure in a direct current superposition (DCS) plasma treatment process, the process depositing a layer of a first material on the initial patterned structure; performing an atomic layer conformal deposition process using a second material, the first material providing protection to the organic mandrel at the beginning of the atomic layer conformal deposition process; performing a spacer etch mandrel pull process, the process creating a final patterned structure with a target final sidewall angle; concurrently controlling integration operating variables in the DCS plasma treatment process, the atomic layer conformal deposition process, and the spacer etch mandrel pull process in order to meet the target final sidewall angle and other integration objectives.

Published as:
US2017358450A1; TW201810370A; TWI655669B; US10354873B2;

Find Patent Forward Citations

Loading…