The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 16, 2019
Filed:
Mar. 28, 2014
Senju Metal Industry Co., Ltd., Tokyo, JP;
Motoki Koroki, Tokyo, JP;
Shunsaku Yoshikawa, Tokyo, JP;
Sakie Okada, Tokyo, JP;
Taro Itoyama, Tokyo, JP;
Hideyuki Komuro, Tokyo, JP;
Naoko Hirai, Tokyo, JP;
Keitaro Shimizu, Tokyo, JP;
SENJU METAL INDUSTRY CO., LTD., Tokyo, JP;
Abstract
A solder paste whereby metal does not flow out of a joint during a second or subsequent reflow heating stage. The solder paste exhibits high joint strength at room temperature and at high temperatures, excels in terms of temporal stability, exhibits minimal void formation, and can form highly cohesive joints. The solder paste comprises a powdered metal component and a flux component, the powdered metal component comprising: a powdered intermetallic compound that comprises copper and tin and has metal barrier layers covering the surfaces thereof and a solder powder including tin as a main component. Neither the powdered intermetallic compound nor the solder powder contains a copper-only phase, inhibiting the elution of copper ions into the flux.