Location History:
- Tochigi, JP (2019)
- Tokyo, JP (2018 - 2022)
Company Filing History:
Years Active: 2018-2025
Title: Sakie Okada: Innovator in Solder Technology
Introduction
Sakie Okada is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of solder technology, holding a total of 7 patents. His innovative work has been instrumental in advancing the materials used in electronic manufacturing.
Latest Patents
Okada's latest patents include a unique solder paste formulation. This solder paste consists of a solder powder and a flux, where the flux is composed of a rosin, an activator, a solvent, and a thixotropic agent containing polyethylene glycol. The content of polyethylene glycol ranges from 10 mass % to 20 mass % relative to the total mass of the flux. Additionally, the thixotropic agent, excluding polyethylene glycol, is limited to 5 mass % or less of the total mass of the flux, while the rosin content is more than 15 mass % and up to 50 mass %. Another notable patent involves a flux that contains a rosin, a solvent, a thixotropic agent, and an activator, where the rosin includes a rosin amine. The solvent is designed to have a first solvent with a boiling point of 250° C. or less, making up 50% by mass or more of the total solvent.
Career Highlights
Sakie Okada is currently employed at Senju Metal Industry Co., Ltd., a company known for its expertise in solder materials. His work has not only contributed to the company's reputation but has also pushed the boundaries of solder technology.
Collaborations
Okada collaborates with talented coworkers, including Kengo Ohta and Shuta Akatsuka. Their combined efforts in research and development have led to innovative solutions in the soldering industry.
Conclusion
Sakie Okada's contributions to solder technology through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence the electronic manufacturing industry significantly.