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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10322462 B1

PDFFull Text
Date of Patent:
Jun. 18, 2019

Filed:

Dec. 29, 2016

Method of printing solder paste

Applicant:

Senju Metal Industry Co., Ltd., Tokyo, JP;

Inventor:

Sakie Okada, Tochigi, JP;

Assignee:

Senju Metal Industry Co., Ltd., Tokyo, JP;

Attorney:

Chernoff, Vilhauer, McClung & Stenzel, LLP

Primary Examiner:

Weiping Zhu

Int. Cl.
CPC ...
B23K 1/00 (2006.01); B23K 3/06 (2006.01); B23K 3/08 (2006.01); B23K 35/36 (2006.01); B23K 35/362 (2006.01); B23K 35/02 (2006.01); H05K 3/12 (2006.01); H05K 3/34 (2006.01); B23K 35/26 (2006.01); C22C 13/00 (2006.01); H05K 3/04 (2006.01); H05K 3/40 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
B23K 1/0016 (2013.01); B23K 3/0638 (2013.01); B23K 3/082 (2013.01); B23K 35/025 (2013.01); B23K 35/0244 (2013.01); B23K 35/262 (2013.01); B23K 35/362 (2013.01); B23K 35/3612 (2013.01); B23K 35/3613 (2013.01); C22C 13/00 (2013.01); H05K 3/04 (2013.01); H05K 3/1233 (2013.01); H05K 3/3484 (2013.01); H05K 3/4007 (2013.01); B23K 2101/42 (2018.08); H05K 2203/0139 (2013.01); H05K 2203/085 (2013.01);
Abstract

A method of printing solder paste on a substrate through minute apertures in a mask member, in which the solder paste is supplied to the apertures of the mask member under less than atmospheric pressure and has a viscosity so that the solder paste is filled in the apertures under atmospheric pressure. It is preferable that the solder paste has a viscosity of 50 through 150 Pa·s and a thixotropic ratio of 0.3 through 0.5. Further, the solder paste is obtained by mixing a flux containing solvent having a boiling point such that volatilization thereof is suppressed under the less than atmospheric pressure and solder powders. It is preferable that in the flux, the solvent having the boiling point of 240° C. or more is used and the solvent is octanediol.

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