Company Filing History:
Years Active: 2018-2019
Title: Innovations by Hideyuki Komuro in Solder Paste Technology
Introduction
Hideyuki Komuro is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of solder paste technology, holding 2 patents that enhance the performance and reliability of solder joints in electronic applications.
Latest Patents
Komuro's latest patents focus on a unique solder paste formulation. The first patent describes a solder paste that prevents metal from flowing out of a joint during subsequent reflow heating stages. This solder paste exhibits high joint strength at both room temperature and elevated temperatures. It is characterized by its temporal stability and minimal void formation, allowing for the creation of highly cohesive joints. The formulation includes a powdered metal component and a flux component, with the powdered metal comprising a powdered intermetallic compound of copper and tin, along with a solder powder primarily made of tin. Importantly, neither component contains a copper-only phase, which helps inhibit the elution of copper ions into the flux.
The second patent also details a solder paste that maintains high joint strength and excels in temporal stability. This formulation consists of 10-70 mass % of a powdered intermetallic compound made of copper and tin, and 30-90 mass % of a solder powder with tin as the main component. Similar to the first patent, this formulation avoids a copper-only phase, ensuring the integrity of the solder joint.
Career Highlights
Hideyuki Komuro is associated with Senju Metal Industry Co., Ltd., a company known for its advancements in metal and solder technologies. His work has significantly impacted the industry, particularly in improving the reliability of solder joints in electronic devices.
Collaborations
Komuro has collaborated with notable colleagues, including Motoki Koroki and Shunsaku Yoshikawa. Their combined expertise has contributed to the development of innovative solder paste solutions.
Conclusion
Hideyuki Komuro's contributions to solder paste technology demonstrate his commitment to innovation and excellence in the field. His patents reflect a deep understanding of material science and its application in electronics, paving the way for more reliable electronic connections.