Company Filing History:
Years Active: 2018-2019
Title: Motoki Koroki: Innovator in Solder Paste Technology
Introduction
Motoki Koroki is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of solder paste technology, holding 2 patents that showcase his innovative approach to enhancing joint strength and stability in electronic components.
Latest Patents
Koroki's latest patents focus on a unique solder paste formulation. One of his inventions is a solder paste that prevents metal from flowing out of a joint during subsequent reflow heating stages. This solder paste demonstrates high joint strength at both room temperature and elevated temperatures. It excels in temporal stability, minimizes void formation, and forms highly cohesive joints. The formulation includes a powdered metal component and a flux component, with the powdered metal comprising a powdered intermetallic compound of copper and tin, along with a solder powder primarily made of tin. Importantly, neither component contains a copper-only phase, which inhibits the elution of copper ions into the flux.
Career Highlights
Motoki Koroki is associated with Senju Metal Industry Co., Ltd., where he has been instrumental in developing advanced solder paste solutions. His work has significantly impacted the electronics manufacturing industry, providing reliable materials for high-performance applications.
Collaborations
Koroki collaborates with talented individuals such as Shunsaku Yoshikawa and Sakie Okada, contributing to a dynamic team focused on innovation in solder technology.
Conclusion
Motoki Koroki's contributions to solder paste technology reflect his dedication to innovation and excellence. His patents not only enhance the performance of electronic components but also pave the way for future advancements in the field.