Company Filing History:
Years Active: 2017-2019
Title: Naoko Hirai: Innovator in Solder Paste Technology
Introduction
Naoko Hirai is a prominent inventor based in Tokyo, Japan. She has made significant contributions to the field of solder paste technology, holding a total of 3 patents. Her innovative work focuses on enhancing the performance and stability of solder pastes used in electronic applications.
Latest Patents
Hirai's latest patents include a groundbreaking solder paste formulation that prevents metal from flowing out of joints during subsequent reflow heating stages. This solder paste demonstrates high joint strength at both room temperature and elevated temperatures. It excels in temporal stability and minimizes void formation, allowing for the creation of highly cohesive joints. The formulation consists of a powdered metal component and a flux component, with the powdered metal component including a powdered intermetallic compound made of copper and tin, as well as a solder powder primarily composed of tin. Importantly, neither component contains a copper-only phase, which helps inhibit the elution of copper ions into the flux.
Career Highlights
Naoko Hirai is currently employed at Senju Metal Industry Co., Ltd., where she continues to develop innovative solder paste solutions. Her work has significantly impacted the electronics manufacturing industry, providing enhanced reliability and performance in soldering applications.
Collaborations
Hirai collaborates with notable colleagues, including Shunsaku Yoshikawa and Motoki Koroki, to further advance solder paste technology and its applications in various industries.
Conclusion
Naoko Hirai's contributions to solder paste technology exemplify her dedication to innovation and excellence. Her patents reflect a commitment to improving the performance and reliability of electronic components, making her a key figure in the field.