The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 09, 2019
Filed:
Aug. 03, 2016
Phoenix Pioneer Technology Co., Ltd., Hsinchu County, TW;
Chun-Hsien Yu, Hsinchu County, TW;
Shih-Ping Hsu, Hsinchu County, TW;
Pao-Hung Chou, Hsinchu County, TW;
Chi-Feng Peng, Hsinchu County, TW;
PHOENIX PIONEER TECHNOLOGY CO., LTD., Hsinchu County, TW;
Abstract
This disclosure provides a package substrate and its fabrication method. The package substrate comprises: a first dielectric material layer have an opening; a first conductive unit including a first part in the opening of the first dielectric material layer and a second part on the first dielectric material layer; and a second dielectric material layer covering the first conductive unit and the first dielectric material layer; wherein a height of the first conductive unit is larger than a thickness of the first dielectric material layer; wherein a cross-section of the second part is larger than that of the first part in the first conductive unit.