Chi-Feng Peng

Title: The Innovative Contributions of Chi-Feng Peng

Introduction

Chi-Feng Peng is a distinguished inventor based in Hsinchu County, Taiwan. With a focus on technological advancements, he has made significant strides in the field of package substrates. His work not only showcases his inventiveness but also contributes to the evolving landscape of electronic packaging.

Latest Patents

Chi-Feng Peng holds a patent for a package substrate and its fabrication method. This innovative disclosure details a package substrate that includes a first dielectric material layer with an opening and a first conductive unit. The first conductive unit consists of two parts: the first part situated in the opening of the dielectric layer, and the second part resting on top of it. The unique design also features a second dielectric material layer that encases both the first conductive unit and the first dielectric material layer. A standout aspect of Peng's invention is that the height of the first conductive unit exceeds the thickness of the dielectric layer, with the cross-section of the second part being larger than that of the first part.

Career Highlights

Chi-Feng Peng is currently affiliated with Phoenix Pioneer Technology Co., Ltd., a company known for its commitment to innovation and technological solutions in the electronics sector. His work is instrumental in advancing the field of package substrates, which play a critical role in the assembly and functionality of electronic devices.

Collaborations

Throughout his career, Chi-Feng has collaborated with talented individuals such as Chun-Hsien Yu and Shih-Ping Hsu. These partnerships highlight the collaborative spirit that drives innovations within the technology sphere, fostering an environment where inventive ideas can flourish.

Conclusion

Chi-Feng Peng's contributions to the field of electronic packaging are noteworthy. His patented invention reflects a deep understanding of material science and engineering principles, enhancing the efficiency of electronic components. As technology continues to evolve, the impact of his innovations will likely resonate throughout the industry for years to come.