The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 07, 2019
Filed:
May. 19, 2017
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Chih-Wei Lin, Hsinchu County, TW;
Shing-Chao Chen, Hsinchu County, TW;
Ching-Hua Hsieh, Hsinchu, TW;
Chen-Hua Yu, Hsinchu, TW;
Chung-Shi Liu, Hsinchu, TW;
Meng-Tse Chen, Pingtung County, TW;
Sheng-Hsiang Chiu, Tainan, TW;
Sheng-Feng Weng, Taichung, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Abstract
A semiconductor package and a manufacturing method for the semiconductor package are provided. The semiconductor package includes a chip, a molding compound, and a dielectric layer. The chip has a connector thereon. The molding compound encapsulates the chip, wherein a surface of the molding compound is substantially lower than an active surface of the chip. The dielectric layer is disposed over the chip and the molding compound, wherein the dielectric layer has a planar surface, and a material of the dielectric layer is different from a material of the molding compound.