The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 30, 2019

Filed:

Jan. 22, 2016
Applicants:

Rohm and Haas Electronic Materials Cmp Holdings, Inc., Newark, DE (US);

Dow Global Technologies Llc, Midland, MI (US);

Inventors:

Scott Chang, Taipei, TW;

Jeff Tsai, Chunan, TW;

Francis V. Acholla, New Castle, DE (US);

Andrew Wank, Avondale, PA (US);

Mark Gazze, Lincoln University, PA (US);

William A. Heeschen, Midland, MI (US);

James David Tate, Lake Jackson, TX (US);

Leo H. Chiang, Pearland, TX (US);

Swee-Teng Chin, Pearland, TX (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B24B 49/12 (2006.01); G01N 21/958 (2006.01); G01N 21/59 (2006.01); B24B 37/26 (2012.01); B24B 37/34 (2012.01); B24B 1/00 (2006.01); H01L 21/321 (2006.01); B24B 37/20 (2012.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
B24B 49/12 (2013.01); B24B 37/26 (2013.01); B24B 37/34 (2013.01); G01N 21/59 (2013.01); G01N 21/958 (2013.01); B24B 1/00 (2013.01); B24B 37/20 (2013.01); H01L 21/3212 (2013.01); H01L 21/7684 (2013.01);
Abstract

A polishing layer analyzer is provided, wherein the analyzer is configured to detect macro inhomogeneities is polymeric sheets and to classify the polymeric sheets as either acceptable or suspect.


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