The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 12, 2019

Filed:

Oct. 26, 2016
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Annalisa Cappellani, Portland, OR (US);

Abhijit Jayant Pethe, Hillsboro, OR (US);

Tahir Ghani, Portland, OR (US);

Harry Gomez, Hillsboro, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 29/423 (2006.01); H01L 21/84 (2006.01); H01L 21/306 (2006.01); H01L 29/66 (2006.01); H01L 29/08 (2006.01); B82Y 10/00 (2011.01); H01L 29/775 (2006.01); H01L 29/78 (2006.01); H01L 29/786 (2006.01); H01L 29/40 (2006.01); H01L 29/417 (2006.01); H01L 21/762 (2006.01);
U.S. Cl.
CPC ...
H01L 29/42392 (2013.01); B82Y 10/00 (2013.01); H01L 21/30604 (2013.01); H01L 21/845 (2013.01); H01L 29/0649 (2013.01); H01L 29/0673 (2013.01); H01L 29/0847 (2013.01); H01L 29/401 (2013.01); H01L 29/41725 (2013.01); H01L 29/42356 (2013.01); H01L 29/66439 (2013.01); H01L 29/66545 (2013.01); H01L 29/775 (2013.01); H01L 29/785 (2013.01); H01L 29/7848 (2013.01); H01L 29/78696 (2013.01);
Abstract

Strained gate-all-around semiconductor devices formed on globally or locally isolated substrates are described. For example, a semiconductor device includes a semiconductor substrate. An insulating structure is disposed above the semiconductor substrate. A three-dimensional channel region is disposed above the insulating structure. Source and drain regions are disposed on either side of the three-dimensional channel region and on an epitaxial seed layer. The epitaxial seed layer is composed of a semiconductor material different from the three-dimensional channel region and disposed on the insulating structure. A gate electrode stack surrounds the three-dimensional channel region with a portion disposed on the insulating structure and laterally adjacent to the epitaxial seed layer.


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