The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 29, 2019

Filed:

Aug. 19, 2014
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Chia-Hong Jan, Portland, OR (US);

Walid Hafez, Portland, OR (US);

Hsu-Yu Chang, Hillsboro, OR (US);

Roman Olac-Vaw, Hillsboro, OR (US);

Ting Chang, Portland, OR (US);

Rahul Ramaswamy, Hillsboro, OR (US);

Pei-Chi Liu, Portland, OR (US);

Neville Dias, Hillsboro, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/423 (2006.01); H01L 29/78 (2006.01); H01L 21/28 (2006.01); H01L 29/49 (2006.01); H01L 29/66 (2006.01); H01L 21/8234 (2006.01); H01L 27/088 (2006.01); H01L 21/3213 (2006.01); H01L 23/535 (2006.01); H01L 23/66 (2006.01); H01L 21/3115 (2006.01);
U.S. Cl.
CPC ...
H01L 29/42376 (2013.01); H01L 21/28088 (2013.01); H01L 21/32134 (2013.01); H01L 21/32136 (2013.01); H01L 21/32139 (2013.01); H01L 21/82345 (2013.01); H01L 21/823456 (2013.01); H01L 21/823475 (2013.01); H01L 23/535 (2013.01); H01L 23/66 (2013.01); H01L 27/088 (2013.01); H01L 29/4966 (2013.01); H01L 29/4983 (2013.01); H01L 29/66545 (2013.01); H01L 29/78 (2013.01); H01L 21/31155 (2013.01);
Abstract

Semiconductor device(s) including a transistor with a gate electrode having a work function monotonically graduating across the gate electrode length, and method(s) to fabricate such a device. In embodiments, a gate metal work function is graduated between source and drain edges of the gate electrode for improved high voltage performance. In embodiments, thickness of a gate metal graduates from a non-zero value at the source edge to a greater thickness at the drain edge. In further embodiments, a high voltage transistor with graduated gate metal thickness is integrated with another transistor employing a gate electrode metal of nominal thickness. In embodiments, a method of fabricating a semiconductor device includes graduating a gate metal thickness between a source end and drain end by non-uniformly recessing the first gate metal within the first opening relative to the surrounding dielectric.


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