The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 25, 2018

Filed:

Sep. 11, 2015
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Yen-Ru Lee, Hsinchu, TW;

Chii-Horng Li, Hsinchu County, TW;

Heng-Wen Ting, Hsinchu, TW;

Tzu-Hsiang Hsu, Hsinchu County, TW;

Chih-Yun Chin, Taichung, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 29/06 (2006.01); H01L 29/08 (2006.01); H01L 29/66 (2006.01); H01L 29/165 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7848 (2013.01); H01L 29/0653 (2013.01); H01L 29/0847 (2013.01); H01L 29/66795 (2013.01); H01L 29/7851 (2013.01); H01L 29/165 (2013.01);
Abstract

A semiconductor device includes a substrate, at least one first isolation structure, at least two second isolation structures, and a plurality of epitaxy structures. The substrate has a plurality of semiconductor fins therein. The first isolation structure is disposed between the semiconductor fins. The semiconductor fins are disposed between the second isolation structures, and the second isolation structures extend into the substrate further than the first isolation structure. The epitaxy structures are respectively disposed on the semiconductor fins. The epitaxy structures are separated from each other, and at least one of the epitaxy structures has a substantially round profile.


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