The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 25, 2018
Filed:
Oct. 26, 2017
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Wen-Hsin Wei, Hsinchu, TW;
Chi-Hsi Wu, Hsinchu, TW;
Chen-Hua Yu, Hsinchu, TW;
Hsien-Pin Hu, Zhubei, TW;
Shang-Yun Hou, Zhubei, TW;
Wei-Ming Chen, Taipei, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Abstract
Formation methods of a chip package are provided. The method includes bonding a first chip structure and a second chip structure over a substrate. The method also includes forming a release film to cover top surfaces of the first chip structure and the second chip structure. The method further includes forming a package layer to surround the first chip structure and the second chip structure after the formation of the release film. In addition, the method includes removing the release film such that the top surface of the first chip structure, the top surface of the second chip structure, and a top surface of the package layer are exposed.