The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 25, 2018

Filed:

Jun. 12, 2017
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Chao-Hsun Wang, Chung-Li, TW;

Shih-Wen Liu, Taoyuan, TW;

Fu-Kai Yang, Hsinchu, TW;

Hsien-Cheng Wang, Hsinchu, TW;

Mei-Yun Wang, Chu-Pei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 23/485 (2006.01); H01L 21/8234 (2006.01); H01L 21/285 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76895 (2013.01); H01L 21/76834 (2013.01); H01L 21/76883 (2013.01); H01L 21/76897 (2013.01); H01L 23/485 (2013.01); H01L 21/28518 (2013.01); H01L 21/76843 (2013.01); H01L 21/76855 (2013.01); H01L 21/823425 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A method for forming a self-aligned contact is provided. In an embodiment, a metal gate is formed on a substrate, and a gate spacer is formed adjacent the metal gate. A conductive plug is formed over the substrate, with the gate spacer disposed between the metal gate and the conductive plug. The metal gate and the conductive plug are recessed. A first dielectric layer is deposited over the gate spacer, over the metal gate, over the conductive plug, and along sidewalls of the metal gate. A first opening is formed in the first dielectric layer exposing the metal gate, and a second opening is formed in the first dielectric layer exposing the conductive plug. The first opening and the second opening are filled with a first conductive material.


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