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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10157874 B1

PDFFull Text
Date of Patent:
Dec. 18, 2018

Filed:

Aug. 21, 2017

Contact area design for solder bonding

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Pei-Chun Tsai, Zhongli, TW;

Yu-Feng Chen, Hsinchu, TW;

Tin-Hao Kuo, Hsinchu, TW;

Chen-Shien Chen, Hsinchu, TW;

Yu-Chih Huang, Hsinchu, TW;

Sheng-Yu Wu, Hsinchu, TW;

Assignee:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Attorney:

Slater Matsil, LLP

Primary Examiner:

S V Clark

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 29/40 (2006.01); H01L 23/52 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/14 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H01L 24/17 (2013.01); H01L 23/147 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H05K 1/111 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/16057 (2013.01); H01L 2224/16113 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16238 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15313 (2013.01); H05K 2201/0969 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/10674 (2013.01); Y02P 70/611 (2015.11);
Abstract

A package component includes a dielectric layer and a metal pad over the dielectric layer. A plurality of openings is disposed in the metal pad. The first plurality of openings is separated from each other by portions of the metal pad, with the portions of the metal pad interconnected to form a continuous metal region.

Find Patent Forward Citations

Tsai, Pei-Chun. (2018). Contact area design for solder bonding (U.S. Patent No. 10157874). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10157874

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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