The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 13, 2018
Filed:
Feb. 02, 2016
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Wei-Ting Chen, Tainan, TW;
Tzu-Chun Tang, Kaohsiung, TW;
Ming Hung Tseng, Miaoli County, TW;
In-Tsang Lin, Kaohsiung, TW;
Vincent Chen, Taipei, TW;
Chuei-Tang Wang, Taichung, TW;
Hung-Yi Kuo, Taipei, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Abstract
A fan-out package structure is disclosed. The fan-out package structure includes an antenna main body; a redistribution layer (RDL); and an antenna auxiliary body in the RDL. An antenna system is also disclosed. The antenna system includes: an antenna main body, arranged to provide a first resonance; and an antenna auxiliary body, arranged to provide a second resonance through parasitic coupling to the antenna main body; wherein a dimension of the antenna main body is greater than a dimension of the antenna auxiliary body. An associated semiconductor packaging method is also disclosed.