The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 25, 2018

Filed:

Nov. 23, 2016
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Min Suet Lim, Simpang Ampat, MY;

Chin Lee Kuan, Bayan Lepas, MY;

Eng Huat Goh, Penang, MY;

Khang Choong Yong, Puchong, MY;

Bok Eng Cheah, Bukit Gambir, MY;

Jackson Chung Peng Kong, Tanjung Tokong, MY;

Howe Yin Loo, Sungai Petani, MY;

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 23/64 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/645 (2013.01); H01L 21/4853 (2013.01); H01L 21/56 (2013.01); H01L 23/3157 (2013.01); H01L 23/49811 (2013.01); H01L 23/49816 (2013.01);
Abstract

A device and method of utilizing spiral interconnects for voltage and power regulation are shown. Examples of spiral interconnects include air core inductors. An integrated circuit package attached to a motherboard using spiral interconnects is shown. Methods of attaching an integrated circuit package to a motherboard using spiral interconnects are shown including air core inductors. Methods of attaching spiral interconnects include using electrically conductive adhesive or solder.


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