The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 25, 2018

Filed:

Jun. 19, 2015
Applicant:

Revera, Incorporated, Santa Clara, CA (US);

Inventors:

Heath A. Pois, Fremont, CA (US);

Wei Ti Lee, San Jose, CA (US);

Lawrence V. Bot, Maple Grove, MN (US);

Michael C. Kwan, Sunnyvale, CA (US);

Mark Klare, Poughkeepsie, NY (US);

Charles Thomas Larson, Belmont, CA (US);

Assignee:

NOVA MEASURING INSTRUMENTS INC., Santa Clara, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01B 15/02 (2006.01); G01N 23/223 (2006.01); G01N 23/2273 (2018.01);
U.S. Cl.
CPC ...
G01B 15/02 (2013.01); G01N 23/223 (2013.01); G01N 23/2273 (2013.01);
Abstract

Methods and systems for feed-forward of multi-layer and multi-process information using XPS and XRF technolgies are disclosed. In an example, a method of thin film characterization includes measuring first XPS and XRF intensity signals for a sample having a first layer above a substrate. A thickness of the first layer is determined based on the first XPS and XRF intensity signals. The information for the first layer and for the substrate is combined to estimate an effective substrate. Second XPS and XRF intensity signals are measured for a sample having a second layer above the first layer above the substrate. The method also involves determining a thickness of the second layer based on the second XPS and XRF intensity signals, the thickness accounting for the effective substrate.


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