The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 19, 2018

Filed:

Dec. 16, 2016
Applicant:

Varian Semiconductor Equipment Associates, Inc., Gloucester, MA (US);

Inventors:

Kevin Anglin, Somerville, MA (US);

Tristan Ma, Lexington, MA (US);

Morgan D. Evans, Manchester, MA (US);

John Hautala, Beverly, MA (US);

Heyun Yin, Saugus, MA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/263 (2006.01); H01L 21/66 (2006.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
H01L 21/2633 (2013.01); H01J 37/32009 (2013.01); H01J 37/32935 (2013.01); H01L 22/12 (2013.01); H01J 2237/334 (2013.01);
Abstract

A method of etching a workpiece comprising two or more materials is disclosed. The method involves using physical sputtering as the etching method where the processing parameters of the sputtering process are tuned to achieve a desired etch rate selectivity. The method includes determining the etch rate of each material disposed on the workpiece as a function of various processing parameters, such as ion species, ion energy, incidence angle and temperature. Once the relationship between etch rate and these parameters is determined for each material, a set of values for these processing parameters may be chosen to achieve the desired etch rate selectivity.


Find Patent Forward Citations

Loading…