Zong-Hua Li

Title: **Innovations of Zong-Hua Li: A Trailblazer in Circuit Board Technology**

Introduction

Zong-Hua Li, an accomplished inventor based in Taoyuan, Taiwan, has made significant contributions to the field of circuit board technology. With a total of five patents to his name, his innovations have been instrumental in advancing manufacturing processes and enhancing the performance of multilayer circuit boards.

Latest Patents

Among Zong-Hua Li’s notable inventions is a groundbreaking patent titled "Multilayer Circuit Board Structure and Manufacturing Method Thereof." This innovation features a sophisticated multilayer circuit board structure that includes both a first and second multilayer circuit board. The first board is equipped with a patterned circuit layer surrounded by a dummy circuit layer, while the second board mirrors this structure. This design allows for improved bonding between the circuit layers and creates a hollow space that enhances functionality.

Another significant patent is the "Structure and Manufacturing Method of Heat Dissipation Substrate and Package Structure Thereof." This invention introduces a multilayer circuit board comprising a core board and additional build-up boards. It incorporates a heat conduction layer that is strategically integrated within or on the surface of the core board. The design includes a cavity structure that exposes the heat conduction layer, with bonding pads and vias that facilitate efficient heat distribution. Such enhancements are essential for maintaining optimal performance in electronic devices.

Career Highlights

Zong-Hua Li is further distinguished by his role at Unimicron Technology Corporation, a leading company in the design and manufacturing of printed circuit boards. His focus on innovative solutions has contributed to the company's reputation as a pioneer in the electronics industry.

Collaborations

Throughout his career, Zong-Hua has collaborated with talented individuals in the field, including coworkers Shao-Chien Lee and Wen-Fang Liu. These collaborations highlight the collective effort within the industry to push the boundaries of circuit board technology and ensure that innovation remains at the forefront.

Conclusion

Zong-Hua Li's inventive spirit and commitment to excellence have positioned him as a key figure in the realm of circuit board technology. His patents not only exemplify technical brilliance but also pave the way for future advancements in electronic manufacturing. As technology continues to evolve, innovators like Zong-Hua will undoubtedly play a pivotal role in shaping the next generation of electronic devices.