The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 2019
Filed:
Jan. 26, 2018
Applicant:
Unimicron Technology Corp., Taoyuan, TW;
Inventors:
Po-Hsuan Liao, Taoyuan, TW;
Zong-Hua Li, Taoyuan, TW;
Assignee:
UNIMICRON TECHNOLOGY CORP., Taoyuan, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/13 (2006.01); H01L 33/58 (2010.01); H01L 33/52 (2010.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 21/4853 (2013.01); H01L 23/13 (2013.01); H01L 23/49838 (2013.01); H01L 23/49894 (2013.01); H01L 33/52 (2013.01); H01L 33/58 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0066 (2013.01);
Abstract
A circuit board includes a base plate, a first circuit layer, a first dielectric layer, and a light emitting element. The first circuit layer is disposed on the base plate. The first dielectric layer is disposed on the base plate and has plural openings. The first circuit layer is embedded in the first dielectric layer and exposes the openings. A Young's modulus of the first dielectric layer is greater than a Young's modulus of the base plate. The light emitting element is electrically connected to the first circuit layer through the openings.