Daejeon, South Korea

Zin Sig Kim

USPTO Granted Patents = 8 

Average Co-Inventor Count = 6.5

ph-index = 2

Forward Citations = 21(Granted Patents)


Company Filing History:


Years Active: 2011-2018

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8 patents (USPTO):Explore Patents

Title: Innovations of Zin Sig Kim

Introduction

Zin Sig Kim is a prominent inventor based in Daejeon, South Korea. He has made significant contributions to the field of semiconductor technology and fiber fabrication. With a total of eight patents to his name, Kim's work reflects a commitment to advancing technology and improving existing processes.

Latest Patents

One of Kim's latest patents is a semiconductor device and fabrication method. This invention includes a substrate, an active layer formed on top of the substrate, and a protective layer with a first aperture. The device features source, driving gate, and drain electrodes, along with a first additional gate electrode designed to manage the electric field applied to the active layer. Another notable patent is a method of fabricating a fiber. This innovative approach allows for the electrospinning of different monomer solutions through nozzles, enabling the formation of polymer fibers without the need for complex preparation processes.

Career Highlights

Zin Sig Kim has worked with notable organizations such as the Electronics and Telecommunications Research Institute and Intellectual Discovery Co., Ltd. His experience in these institutions has allowed him to develop and refine his innovative ideas, contributing to advancements in technology.

Collaborations

Throughout his career, Kim has collaborated with talented individuals, including Ji Man Park and Joo Yeon Kim. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

Zin Sig Kim's contributions to the fields of semiconductor devices and fiber fabrication highlight his innovative spirit and dedication to technological advancement. His patents reflect a deep understanding of complex processes and a commitment to simplifying them for broader application.

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