This inventor holds 2 USPTO granted patents. Top assignee: Kla Tencor Corporation. Active years: 2019-2022.
Company Filing History:
Years Active: 2019-2022
Title: Innovations by Zhu-bin Shi in Resistivity Probes
Introduction
Zhu-bin Shi is a notable inventor based in Shanghai, China. He has made significant contributions to the field of integrated circuit testing through his innovative designs of resistivity probes. With a total of 2 patents, his work has garnered attention in the technology sector.
Latest Patents
Zhu-bin Shi's latest patents include advancements in resistivity probes. One of his patents focuses on resistivity probes with curved portions. These probes are designed to test integrated circuits effectively. In this design, a resistivity probe features a substrate with multiple vias and metal pins. Each metal pin is positioned within a via and extends out of the substrate, with interconnects providing electrical connections. Another patent involves resistivity probes with movable needle bodies, which also utilize a substrate with multiple vias and metal pins. This design enhances the functionality of the probes in integrated circuit testing.
Career Highlights
Zhu-bin Shi is currently employed at Kla Tencor Corporation, where he continues to innovate in the field of semiconductor testing. His work has been instrumental in developing tools that improve the accuracy and efficiency of integrated circuit testing.
Collaborations
Some of his notable coworkers include Walter H Johnson, III and Nanchang Zhu. Their collaboration has contributed to the advancement of technologies in the semiconductor industry.
Conclusion
Zhu-bin Shi's contributions to the field of resistivity probes demonstrate his commitment to innovation in integrated circuit testing. His patents reflect a deep understanding of the technical challenges in this area and provide solutions that enhance testing capabilities.