Zheng-Heng Sun is a prolific inventor and engineer hailing from Taipei Hsien, Taiwan. With an impressive track record of 171 patents to his name, Sun has made significant contributions to the field of heat dissipation technology. His latest patents, including a heat dissipation simulator and a circuit board mounting apparatus, showcase his ingenuity and commitment to improving electronic device performance.

Latest Patents:

One of Sun's recent groundbreaking inventions is the heat dissipation simulator. This simulator is designed to replicate the working conditions of a component on a printed circuit board (PCB) and provide a realistic heat dissipation scenario. The simulator comprises a simulation board consisting of an iron layer and a plastic layer, and a simulated heat source, which includes a simulation chip, a thermal piece, and a heat sink. By accurately simulating the working states of various components, this innovation enables researchers and engineers to develop more efficient heat dissipation solutions for electronic devices.

Another significant patent by Sun is the circuit board mounting apparatus. This apparatus offers versatile mounting options for circuit boards, allowing them to be securely mounted to either a first side plate of a first chassis or a second side plate of a second chassis. It incorporates three mounting members - the first and second mounting members on the front side of the circuit board and the third mounting member on the rear side. This unique design enables efficient mounting and enhances the flexibility of device assembly.

Career Highlights:

Zheng-Heng Sun has an illustrious career, having worked with industry leaders such as Hon Hai Precision Industry Co., Ltd. and Hong-Fu Jin Precision Industry (Shenzhen) Co., Ltd. His work experience with these renowned companies underscores his expertise in the field of electronics manufacturing and heat dissipation technologies. Throughout his career, Sun has consistently showcased his dedication to innovation, earning him recognition as a leading contributor in his field.

Collaborations:

Collaboration is at the core of Zheng-Heng Sun's approach to invention and innovation. He has had the privilege of working alongside esteemed colleagues such as An-Gang Liang and Xiao-Feng Ma. These collaborations have proven fruitful, resulting in the development of groundbreaking technologies and contributing to the advancement of heat dissipation solutions.

Conclusion:

Zheng-Heng Sun's extensive patent portfolio and innovative contributions reflect his deep understanding of heat dissipation challenges in electronics. Through his ingenious inventions and extensive collaborations, Sun has played a key role in revolutionizing heat dissipation technology. His dedication to developing efficient and effective solutions continues to inspire the industry, and his influence will be felt for years to come.

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