The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 26, 2017
Filed:
Jun. 25, 2014
Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd., Shenzhen, CN;
Hon Hai Precision Industry Co., Ltd., New Taipei, TW;
Wan-Li Ning, Shenzhen, CN;
Li-Ren Fu, Shenzhen, CN;
Yu Han, Shenzhen, CN;
Jun-Hui Wang, Shenzhen, CN;
Ai-Ling He, Shenzhen, CN;
He Feng, Shenzhen, CN;
Kun Li, Shenzhen, CN;
Shu-Ni Yi, Shenzhen, CN;
Lei Liu, Shenzhen, CN;
An-Gang Liang, Shenzhen, CN;
Ping-Chuan Deng, Shenzhen, CN;
Ming-Yu Liu, Shenzhen, CN;
Xia-Bing Gao, Shenzhen, CN;
Han-Bing Zhang, Shenzhen, CN;
Zheng-Heng Sun, New Taipei, TW;
ScienBiziP Consulting(Shenzhen)Co., Ltd., Shenzhen, CN;
Abstract
A heat dissipation simulator of a component on a printed circuit board (PCB) includes a simulation board and a simulated heat source. The simulation board includes an iron layer and a plastic layer. The simulated heat source includes a simulation chip, a thermal, and a heat sink. The simulation chip, the thermal piece, and the heat sink are mounted on the simulation board in that order. The heat dissipation simulator replaces a sample of the PCB with the component for simulating working states of the component on the PCB.