Company Filing History:
Years Active: 2017
Title: He Feng - Innovator in Heat Dissipation Technology
Introduction
He Feng is a notable inventor based in Shenzhen, China. He has made significant contributions to the field of heat dissipation technology, particularly in the design of components used in printed circuit boards (PCBs). His innovative approach has led to the development of a unique heat dissipation simulator.
Latest Patents
He Feng holds a patent for a heat dissipation simulator. This simulator is designed to replicate the working states of a component on a PCB. The simulator consists of a simulation board that includes an iron layer and a plastic layer, along with a simulated heat source that features a simulation chip, a thermal piece, and a heat sink. This invention allows for effective testing and analysis of heat dissipation in electronic components.
Career Highlights
He Feng is currently employed at Scienbizip Consulting (Shenzhen) Co., Ltd. His work focuses on enhancing the efficiency and reliability of electronic components through innovative heat management solutions. His dedication to research and development has positioned him as a key player in his field.
Collaborations
He Feng collaborates with talented professionals such as Wan-Li Ning and Li-Ren Fu. Together, they work on advancing technologies that improve the performance of electronic devices.
Conclusion
He Feng's contributions to heat dissipation technology exemplify the importance of innovation in the electronics industry. His patent for a heat dissipation simulator showcases his commitment to enhancing the functionality of PCBs.