Zhen Xu

Title: Zhen Xu and Advances in Semiconductor Packaging

Introduction

Zhen Xu is an inventor based in Wuhan, China, whose patent work concerns semiconductor packaging and memory systems. His disclosed invention addresses package structure design and the relationship between package thickness and the position of an encapsulated semiconductor device.

Latest Patents

Xu is associated with 1 patent: “Package Structures, Fabricating Methods Thereof, and Memory Systems.” The patent describes a packaging substrate with opposing surfaces, a semiconductor device coupled to its first surface, and a cap layer that covers the surface and encapsulates the device. It also specifies a thickness relationship between the cap layer, the semiconductor device, and the overall package, supporting defined package dimensions for memory-system applications.

Career Highlights

Xu’s listed patent work is connected to Yangtze Memory Technologies Co., Ltd. The invention reflects the company’s focus on memory-related technologies and semiconductor manufacturing, particularly the design and fabrication of package structures.

Collaborations

Xu’s listed coworkers include Qi Xu and Chao Wang. Their shared association with the company provides context for the professional environment surrounding this patent work.

Conclusion

Zhen Xu’s patent contribution focuses on semiconductor package structures, fabrication methods, and memory systems, linking his work in Wuhan with Yangtze Memory Technologies Co., Ltd.