Chandler, AZ, United States of America

Zhaozhi Li

USPTO Granted Patents = 5 

Average Co-Inventor Count = 5.3

ph-index = 2

Forward Citations = 17(Granted Patents)


Company Filing History:


Years Active: 2017-2023

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5 patents (USPTO):

Title: **Zhaozhi Li: Innovator in Electronic Packaging from Chandler, AZ**

Introduction

Zhaozhi Li is a prominent inventor based in Chandler, AZ, recognized for his contributions to electronic packaging technology. With a remarkable portfolio of five patents, Li has made significant strides in the field of electronics, focusing on innovative packaging methods that enhance the efficiency and performance of electronic devices.

Latest Patents

Among Zhaozhi Li's latest patents is the "Electronic package with stud bump electrical connections." This invention presents an electronic package that incorporates a substrate featuring multiple pads on its major surface. An electronic component also includes several pads facing the substrate. The innovation lies in the stud bump that electrically connects the various pads, facilitating effective communication between components.

Another notable patent is the "Micro-trenching mold interface in a pop package." This embodiment is a sophisticated electronics package consisting of a package substrate and a die mounted on it. A mold layer is strategically positioned over the substrate, and through-mold interconnects are implemented. Furthermore, a trench extends partly into the mold layer, enhancing the overall performance of the electronics package.

Career Highlights

Zhaozhi Li is an integral part of Intel Corporation, where he applies his expertise in developing cutting-edge electronic packaging solutions. His work focuses on improving the design and functionality of electronics, making them more reliable and efficient.

Collaborations

Throughout his career, Zhaozhi has collaborated with notable coworkers, including Robert M. Nickerson and Sanka Ganesan. These collaborations have fostered innovation and creativity in their projects, pushing the boundaries of what is possible within the realm of electronic packaging.

Conclusion

Zhaozhi Li's contributions to the field of electronics through his innovative patents have positioned him as a leading inventor in electronic packaging. His work at Intel Corporation and collaborations with his colleagues continue to inspire advancements in technology, paving the way for future developments in the industry.

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