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For the Inventor, By the Inventor

Chandler, AZ, United States of America

Zhaozhi Li

This inventor holds 8 USPTO granted patents and 4 published patent applications. Top assignee: Intel Corporation. Active years: 2017-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Zhaozhi Li. Retrieved from https://idiyas.com/inventor/zhaozhi-li

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 8 

% Patents Active = 37.5

Average Co-Inventor Count = 5.3

ph-index = 2

Forward Citations = 17(Granted Patents)


Company Filing History:

goldMedal8 out of 56,463 
 
Intel Corporation
 patents

Years Active: 2017-2026

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8 patents (USPTO):Explore Patents
1. 12604754 - Package structures with non-uniform interconnect features (2026-04-14),
2. 12604733 - Package structures with collapse control features (2026-04-14),
3. 12598989 - Package structures with patterned die backside layer (2026-04-07),
4. 11552035 - Electronic package with stud bump electrical connections (2023-01-10),
5. 11462527 - Micro-trenching mold interface in a pop package (2022-10-04),
6. 11127706 - Electronic package with stud bump electrical connections (2021-09-21),
7. 10121722 - Architecture material and process to improve thermal performance of the embedded die package (2018-11-06),
8. 9653411 - Electronic package that includes fine powder coating (2017-05-16),

Title: **Zhaozhi Li: Innovator in Electronic Packaging from Chandler, AZ**

Introduction

Zhaozhi Li is a prominent inventor based in Chandler, AZ, recognized for his contributions to electronic packaging technology. With a remarkable portfolio of five patents, Li has made significant strides in the field of electronics, focusing on innovative packaging methods that enhance the efficiency and performance of electronic devices.

Latest Patents

Among Zhaozhi Li's latest patents is the "Electronic package with stud bump electrical connections." This invention presents an electronic package that incorporates a substrate featuring multiple pads on its major surface. An electronic component also includes several pads facing the substrate. The innovation lies in the stud bump that electrically connects the various pads, facilitating effective communication between components.

Another notable patent is the "Micro-trenching mold interface in a pop package." This embodiment is a sophisticated electronics package consisting of a package substrate and a die mounted on it. A mold layer is strategically positioned over the substrate, and through-mold interconnects are implemented. Furthermore, a trench extends partly into the mold layer, enhancing the overall performance of the electronics package.

Career Highlights

Zhaozhi Li is an integral part of Intel Corporation, where he applies his expertise in developing cutting-edge electronic packaging solutions. His work focuses on improving the design and functionality of electronics, making them more reliable and efficient.

Collaborations

Throughout his career, Zhaozhi has collaborated with notable coworkers, including Robert M. Nickerson and Sanka Ganesan. These collaborations have fostered innovation and creativity in their projects, pushing the boundaries of what is possible within the realm of electronic packaging.

Conclusion

Zhaozhi Li's contributions to the field of electronics through his innovative patents have positioned him as a leading inventor in electronic packaging. His work at Intel Corporation and collaborations with his colleagues continue to inspire advancements in technology, paving the way for future developments in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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