IDiyas

For the Inventor, By the Inventor

Ibaraki-ken, Japan

Yuuto Ootuki

USPTO Granted Patents = 11


Average Co-Inventor Count = 7.0

ph-index = 4

Forward Citations = 105(Granted Patents)


Location History:

  • Hitachi, JP (2001 - 2010)
  • Ibaraki-ken, JP (2002 - 2013)

Company Filing History:

goldMedal11 out of 1,641 
 
Hitachi Chemical Company, Ltd.
 patents

Years Active: 2001-2013

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11 patents (USPTO):
1. 8616936 - Abrasive, method of polishing target member and process for producing semiconductor device (2013-12-31),
2. 8162725 - Abrasive, method of polishing target member and process for producing semiconductor device (2012-04-24),
3. 8137159 - Abrasive, method of polishing target member and process for producing semiconductor device (2012-03-20),
4. 7963825 - Abrasive, method of polishing target member and process for producing semiconductor device (2011-06-21),
5. 7871308 - Abrasive, method of polishing target member and process for producing semiconductor device (2011-01-18),
6. 7867303 - Cerium oxide abrasive and method of polishing substrates (2011-01-11),
7. 7708788 - Cerium oxide abrasive and method of polishing substrates (2010-05-04),
8. 7115021 - Abrasive, method of polishing target member and process for producing semiconductor device (2006-10-03),
9. 6863700 - Cerium oxide abrasive and method of polishing substrates (2005-03-08),
10. 6343976 - Abrasive, method of polishing wafer, and method of producing semiconductor device (2002-02-05),
11. 6221118 - Cerium oxide abrasive and method of polishing substrates (2001-04-24),

Title: The Innovative Mind of Yuuto Ootuki: Advancements in Polishing Technology

Introduction: Yuuto Ootuki, an accomplished inventor based in Ibaraki-ken, Japan, has made significant contributions to the field of semiconductor devices and polishing technologies. With a portfolio of 11 patents, Ootuki's innovations focus on enhancing the efficiency and effectiveness of semiconductor manufacturing processes.

Latest Patents: Among his latest patents is a groundbreaking invention related to abrasives. His patent describes a method of polishing target surfaces of silicon oxide insulating films at a high rate without causing scratches. The abrasive comprises a unique slurry that contains cerium oxide particles and abrasive grains. These ingredients are carefully formulated to optimize the polishing process while minimizing surface damage, highlighting Ootuki's commitment to advancing semiconductor device production.

Career Highlights: Yuuto Ootuki is currently employed at Hitachi Chemical Company, Ltd., where he applies his expertise in material science and engineering to develop innovative solutions. His insightful approach to problem-solving has led to several patents that play a crucial role in the semiconductor industry.

Collaborations: Throughout his career, Ootuki has worked alongside talented professionals such as Masato Yoshida and Toranosuke Ashizawa. These collaborations have not only expanded his professional network but have also fueled the development of innovative projects in semiconductor polishing techniques.

Conclusion: Yuuto Ootuki stands out as a prominent inventor whose work is shaping the future of semiconductor manufacturing. His dedication to innovation and collaboration continues to inspire progress within the industry. With a strong patent portfolio, Ootuki’s contributions are sure to leave a lasting impact on the field.

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