This inventor holds 1 USPTO granted patent. Top assignee: Ulvac, Inc.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Yutaka Nakamitsu and Tungsten-Film Deposition Technology.
Introduction
Yutaka Nakamitsu is an inventor associated with Ulvac, Inc., and is based in Kanagawa, Japan. His listed patent concerns sputtering equipment and a method for depositing tungsten films.
Latest Patents
Nakamitsu is credited with 1 patent: “Sputtering Apparatus and Deposition Method of Tungsten Film.” The invention describes a vacuum chamber containing a tungsten target and a substrate stage that holds the substrate. During deposition, sputtered tungsten particles accumulate on the substrate to form a film. High-frequency power supplied to the substrate stage generates a second plasma atmosphere, causing positive ions in the first plasma atmosphere to collide with the substrate. The patent also defines the relevant electrode areas as the substrate stage’s holding surface and the chamber’s inner surface.
Career Highlights
The available information connects Nakamitsu’s patent work with Ulvac, Inc. His listed invention addresses both sputtering apparatus design and the process used to deposit tungsten films.
Collaborations
The provided information identifies Ulvac, Inc. as Nakamitsu’s company affiliation. It does not specify additional collaborators or research partners.
Conclusion
Yutaka Nakamitsu’s listed patent focuses on using plasma and sputtering techniques to deposit tungsten films on substrates.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile