The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2026

Filed:

Apr. 25, 2025
Applicant:

Ulvac, Inc., Kanagawa, JP;

Inventor:

Yutaka Nakamitsu, Kanagawa, JP;

Assignee:

ULVAC, INC., Kanagawa, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/34 (2006.01); C23C 14/14 (2006.01); C23C 14/50 (2006.01); H01J 37/34 (2006.01); H10P 14/40 (2026.01);
U.S. Cl.
CPC ...
C23C 14/3435 (2013.01); C23C 14/14 (2013.01); C23C 14/3407 (2013.01); C23C 14/50 (2013.01); H01J 37/3441 (2013.01); H01J 2237/332 (2013.01); H10P 14/418 (2026.01);
Abstract

A substrate stage holding a substrate to be treated in a vacuum chamber in which a target made of tungsten is mounted and a high-frequency power source supplying a high-frequency electric power to the substrate stage are provided. When a first plasma atmosphere is generated in the vacuum chamber, and sputtered particles generated by sputtering the target are adhered and accumulated on the substrate so that a tungsten film is deposited, a second plasma atmosphere is generated by supplying the high-frequency electric power to the substrate stage, and plus ions in the first plasma atmosphere are also caused to collide with the substrate. Provided that an area of a substrate holding surface of the substrate stage functioning as one electrode and an inner-surface area of the vacuum chamber functioning as the other electrode of the second plasma atmosphere are defined as an anode area and a cathode area, respectively.


Find Patent Forward Citations

Nakamitsu, Yutaka. (2026). Sputtering apparatus and deposition method of tungsten film (U.S. Patent No. 12760407). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12760407

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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