Kawasaki, Japan

Yuta Konno


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2016-2018

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4 patents (USPTO):Explore Patents

Title: Yuta Konno: Innovator in Ion Beam Technology

Introduction

Yuta Konno is a prominent inventor based in Kawasaki, Japan. He has made significant contributions to the field of ion beam technology, holding a total of four patents. His work focuses on advanced methods and apparatuses for processing substrates using ion beams.

Latest Patents

Konno's latest patents include an "Apparatus and method for processing substrate using ion beam." This invention features a computer-readable recording medium encoded with a program that executes an ion etching method. The method involves etching a substrate arranged on a holder using an ion beam etching apparatus. The program consists of a decremental control program and an incremental control program, each executing specific steps in the process. Another notable patent is the "Ion beam processing method and ion beam processing apparatus." This method includes applying a positive voltage to extract ions into a vacuum container, generating plasma, and processing the substrate by irradiating it with an ion beam.

Career Highlights

Yuta Konno is currently employed at Canon Anelva Corporation, where he continues to innovate in the field of ion beam technology. His work has been instrumental in advancing the capabilities of ion beam processing, which is crucial for various applications in semiconductor manufacturing and materials science.

Collaborations

Konno has collaborated with notable colleagues, including Yasushi Kamiya and Einstein Noel Abarra. Their combined expertise has contributed to the development of cutting-edge technologies in their field.

Conclusion

Yuta Konno's contributions to ion beam technology through his patents and work at Canon Anelva Corporation highlight his role as a leading inventor in this specialized area. His innovative approaches continue to shape the future of substrate processing techniques.

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