This inventor holds 4 USPTO granted patents. Top assignees: Western Digital Technologies, Inc., Hgst Netherlands, B.v.. Active years: 2016-2023.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:


Years Active: 2016-2023
Title: Yusuke Matsumoto: Innovator in Solder Ball Bonding Technology
Introduction
Yusuke Matsumoto is a notable inventor based in Fujisawa, Japan. He has made significant contributions to the field of solder ball bonding technology, holding a total of four patents. His innovative work has been instrumental in advancing the efficiency and reliability of micro solder ball transportation mechanisms.
Latest Patents
One of Matsumoto's latest patents is a reliable transportation mechanism for micro solder balls. This solder ball bonding (SBB) tool features a rotatable feed plate designed to transport solder balls from a translatable solder ball reservoir to a nozzle unit. At this nozzle unit, a laser light source can irradiate and melt the solder balls. The SBB tool incorporates a gap between the reservoir and the feed plate, which is positioned over the reservoir. Additionally, a feed mechanism, driven by pressurized gas, translates the reservoir upward across a portion of the gap to prepare for the movement of a solder ball to the feed plate. After a solder ball is moved to the feed plate, the mechanism allows for downward movement in preparation for the rotation of the feed plate. The gap is designed to have a maximum size that exceeds the nominal size of the solder balls contained in the reservoir.
Career Highlights
Throughout his career, Yusuke Matsumoto has worked with prominent companies such as Western Digital Technologies, Inc. and HGST Netherlands, B.V. His experience in these organizations has contributed to his expertise in the field of micro solder ball technology.
Collaborations
Matsumoto has collaborated with notable professionals in his field, including Kenichi Murata and Yuichi Mori. These collaborations have further enriched his work and innovations in solder ball bonding technology.
Conclusion
Yusuke Matsumoto is a distinguished inventor whose work in solder ball bonding technology has led to significant advancements in the industry. His patents and collaborations reflect his commitment to innovation and excellence in his field.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile