Western Digital Technologies, Inc.

Hgst Netherlands, B.v.

Yusuke Matsumoto

Kenichi Murata

Tatsumi Tsuchiya

Tatsushi Yoshida

Yuichi Mori

Eiki Oosawa

A solder ball bonding (SBB) tool includes a rotatable feed plate for transporting solder balls from a translatable solder ball reservoir to a nozzle unit, which is a position at which a laser light source can irradiate and thus melt the solder balls. The SBB tool includes a gap between the reservoir and the feed plate positioned over the reservoir, and a feed mechanism coupled with the reservoir, where the feed mechanism is driven by a pressurized gas to translate the reservoir upward across at least a portion of the gap in preparation for movement of a solder ball to the feed plate and downward in preparation for rotation of the feed plate after a solder ball is moved to the feed plate. The gap may have a maximum size that exceeds a nominal size of the solder balls contained in the reservoir.

Reliable transportation mechanism for micro solder balls

A solder ball bonding tool includes a nozzle having an inner bore having a plurality of columnar surfaces and interposed retention structures that are positioned within the nozzle to retain a solder ball therein. A projection or projected shape formed by intersecting the retention structures may be generally circular, having a diameter less than the diameter of the solder balls for which the retention structures are positioned to retain. The nozzle may comprise a cemented carbide having less than or equal to a cumulative 4.5% of cobalt and gold serving as a binder.

Solder ball jet nozzle having improved reliability

Approaches to a solder ball bonding (SBB) tool and a method for solder ball bonding work pieces. The SBB tool comprises a rotatable feed plate for transporting solder balls from a reservoir to a nozzle, which is a position at which a laser light source can irradiate and melt the solder balls. The melted solder ball is then ejected from the nozzle and onto one or more work pieces, for electrically interconnecting the work pieces. The feed plate is configured with first holes and second holes, the first holes for receiving and transporting solder balls and the second holes for providing an aperture for the laser light to irradiate the solder balls, as the feed plate rotates and the holes are moved to positions in relation to the reservoir and the nozzle.

Growing community of inventors

Fujisawa, Japan

Yusuke Matsumoto