The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 24, 2018
Filed:
Oct. 29, 2014
Hgst Netherlands B.v., Amsterdam, NL;
Kenichi Murata, Ebina, JP;
Yusuke Matsumoto, Fujisawa, JP;
Yuichi Mori, Hiratsuka, JP;
Eiki Oosawa, Odawara, JP;
Tatsumi Tsuchiya, Ayase, JP;
Tatsushi Yoshida, Fujisawa, JP;
Western Digital Technologies, Inc., San Jose, CA (US);
Abstract
A solder ball bonding tool includes a nozzle having an inner bore having a plurality of columnar surfaces and interposed retention structures that are positioned within the nozzle to retain a solder ball therein. A projection or projected shape formed by intersecting the retention structures may be generally circular, having a diameter less than the diameter of the solder balls for which the retention structures are positioned to retain. The nozzle may comprise a cemented carbide having less than or equal to a cumulative 4.5% of cobalt and gold serving as a binder.