This inventor holds 1 USPTO granted patent. Top assignee: Japan Electronic Materials Corporation. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Yusuke Harada: Innovator in Probe-Card Technology
Introduction
Yusuke Harada is a notable inventor based in Hyogo, Japan. He has made significant contributions to the field of electronic materials, particularly in the development of probe-card technology. His innovative work has led to the filing of a patent that addresses critical challenges in the industry.
Latest Patents
Yusuke Harada holds a patent for a "Probe-card multilayer wiring substrate and probe card." The objective of this invention is to provide a multilayer wiring substrate for probe cards that prevents the deterioration of thin film resistors. The multilayer wiring substrate, referred to as an ST substrate, is designed with a wiring path between an external terminal and a probe of a probe card. It features a base insulating film on its top surface, a thin film resistor, an embedded heat sink, and a cover insulating film. This innovative design enhances the performance and reliability of probe cards in electronic testing applications. He has 1 patent to his name.
Career Highlights
Yusuke Harada is associated with Japan Electronic Materials Corporation, where he has been instrumental in advancing the company's technological capabilities. His work focuses on improving the efficiency and effectiveness of electronic components, particularly in the context of probe cards.
Collaborations
Throughout his career, Yusuke has collaborated with talented individuals such as Shinya Hori and Satoshi Abe. These collaborations have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.
Conclusion
Yusuke Harada's contributions to probe-card technology exemplify the spirit of innovation in the electronics industry. His patent for a multilayer wiring substrate showcases his commitment to enhancing the performance of electronic components. His work continues to influence the field and inspire future advancements.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile