The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 2026
Filed:
Nov. 17, 2020
Japan Electronic Materials Corporation, Hyogo, JP;
Satoshi Abe, Hyogo, JP;
Tetsuo Fujimoto, Hyogo, JP;
Yusuke Harada, Hyogo, JP;
Shinya Hori, Hyogo, JP;
JAPAN ELECTRONIC MATERIALS CORPORATION, Hyogo, JP;
Abstract
An object of the present invention is to provide a multilayer wiring substrate for probe card capable of preventing deterioration of a thin film resistor. Provided is a multilayer wiring substrate (an ST substrate)for probe card, the multilayer wiring substrate being provided on a wiring path between an external terminaland a probeof a probe card, and having a base insulating filmformed on a top surface of the multilayer wiring substrate, in which the multilayer wiring substrateincludes: a thin film resistorincluding a thin film formed on the base insulating filmand to which a pair of connection electrodesare connected; an embedded heat sinkthat is embedded to face the thin film resistorvia the base insulating filmand includes a material having a thermal conductivity higher than that of the base insulating film; and a cover insulating filmthat is formed in a region corresponding to the thin film resistorand covers the thin film resistor, and the embedded heat sinkincludes a heat dissipating portionthat is not covered with the base insulating filmoutside a region in which the cover insulating filmis formed.