This inventor holds 1 USPTO granted patent. Top assignee: Via Labs, Inc.. Active years: 2021.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2021
Title: Innovations of Yun-Tien Liu in Interface Conversion Technology.
Introduction
Yun-Tien Liu is a notable inventor based in New Taipei, Taiwan. He has made significant contributions to the field of interface conversion technology. His innovative work has led to the development of a unique chip and interface conversion device.
Latest Patents
Yun-Tien Liu holds a patent for a chip and interface conversion device. This device includes first, second, third, fourth, fifth, and sixth pads. The first and second pads are coupled to the first and second SBU pins of a USB connector, respectively. The fourth and sixth pads are connected to the first and second pins of an AUX channel of a DP connector, respectively. In the first mode of operation, the chip transmits AUX channel signals to the third and fifth pads, while managing voltage levels on the fourth and sixth pads. In the second mode, the configuration of the pads changes to facilitate different connections.
Career Highlights
Yun-Tien Liu is currently employed at Via Labs, Inc., where he continues to innovate in the field of technology. His work has been instrumental in advancing interface conversion solutions.
Collaborations
Some of his coworkers include Cheng-Chung Lin and Hsiao-Chyi Lin, who contribute to the collaborative environment at Via Labs, Inc.
Conclusion
Yun-Tien Liu's contributions to interface conversion technology exemplify the spirit of innovation. His patent reflects a significant advancement in the field, showcasing his expertise and dedication to technological progress.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile