The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 16, 2021

Filed:

Sep. 17, 2020
Applicant:

Via Labs, Inc., New Taipei, TW;

Inventors:

Yun-Tien Liu, New Taipei, TW;

Cheng-Chung Lin, New Taipei, TW;

Hsiao-Chyi Lin, New Taipei, TW;

Shao-Yu Chen, New Taipei, TW;

Assignee:

VIA LABS, INC., New Taipei, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 13/40 (2006.01); G06F 13/38 (2006.01); G06F 15/78 (2006.01);
U.S. Cl.
CPC ...
G06F 13/4022 (2013.01); G06F 13/385 (2013.01); G06F 15/7842 (2013.01); G06F 2213/0042 (2013.01);
Abstract

A chip and an interface conversion device are provided. The chip includes first, second, third, fourth, fifth and sixth pads. The first and second pads are coupled to first and second SBU pins of a USB connector respectively. The fourth and the sixth pads are coupled to first and second pins of an AUX channel of a DP connector respectively. When the chip operates in a first mode, first and second AUX channel signals generated by the chip are transmitted to the third and fifth pads respectively, a voltage of the fourth pad is weakly pulled down, and a voltage of the sixth pad is weakly pulled up. When the chip operates in a second mode, one of the first and second pads is connected to the fourth pad, and the other one of the first and second pads is connected to the sixth pad.


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