Yun-Hsin Liao

This inventor holds 20 USPTO granted patents, primarily in Conductive Polymers. Top assignees: International Business Machines Corporation, Globalfoundries Inc.. Active years: 1997-2016.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yun-Hsin Liao. Retrieved from https://idiyas.com/inventor/yun-hsin-liao

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 20

% Patents Active = 75.0

Average Co-Inventor Count = 3.6

ph-index = 8

Forward Citations = 580(Granted Patents)

Location History:

W. Nyack, NY (US) (1997 - 1998)
Tarrytown, NY (US) (1999 - 2003)
Tempe, AZ (US) (1998 - 2016)

Company Filing History:

19 out of 166,351

International Business Machines Corporation

Years Active: 1997-2016

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Areas of Expertise:

Conductive Polymers

Probe Structures

Electrodeposition

Fabrication Methods

Elongated Conductors

Polymer Morphology

Foamed Elastomers

High Conductivity

Branched Polymers

Insulated Probe Tips

Electrical Conductivity

Synthesis Methods

20 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9404942 - Coaxial probe structure of elongated electrical conductors projecting from a support structure (2016-08-02),

2. 8754666 - Probe structure having a plurality of discrete insulated probe tips projecting from a support surface, apparatus for use thereof and methods of fabrication thereof (2014-06-17),

3. 8491772 - Redox method of forming a coaxial probe structure of elongated electrical conductors projecting from a support structure (2013-07-23),

4. 8486250 - Electrodeposition method of forming a probe structure having a plurality of discrete insulated probe tips projecting from a support surface (2013-07-16),

5. 8198396 - Methods of fabricating plasticized, antiplasticized and crystalline conducting polymers and precursors thereof (2012-06-12),

6. 7902323 - Methods of fabricating plasticized, antiplasticized and crystalline conducting polymers and precursors thereof (2011-03-08),

7. 7368924 - Probe structure having a plurality of discrete insulated probe tips projecting from a support surface, apparatus for use thereof and methods of fabrication thereof (2008-05-06),

8. 6967236 - Methods of processing and synthesizing electrically conductive polymers and precursors thereof to form electrically conductive polymers having high electrical conductivity (2005-11-22),

9. 6616863 - Plasticized, antiplasticized and crystalline conducting polymers and precursors thereof (2003-09-09),

10. 6452406 - Probe structure having a plurality of discrete insulated probe tips (2002-09-17),

11. 6241913 - Branched electrically conductive polymers and precursors and applications thereof (2001-06-05),

12. 6210606 - Polycrystalline conducting polymers and precursors thereof having adjustable morphology and properties (2001-04-03),

13. 6054651 - Foamed elastomers for wafer probing applications and interposer (2000-04-25),

14. 5969024 - Methods of fabricating plasticized, antiplasticized and crystalline (1999-10-19),

15. 5958301 - Methods of fabricating branched electrially conductive polymers and (1999-09-28),

Title: Innovator in Electrical Probing Technologies - Yun-Hsin Liao

Introduction

Yun-Hsin Liao is an accomplished inventor based in Tempe, AZ, renowned for his significant contributions to the field of electrical probing technologies. With a remarkable portfolio of 20 patents, Liao has made strides in advancing the utility of coaxial probe structures used in testing electrical interconnections within electronic devices. His innovations are pivotal for industries focusing on integrated circuit devices and multi-chip module packages.

Latest Patents

Liao's recent patents demonstrate his expertise in developing specialized coaxial probe structures. His noteworthy patents include a "Coaxial probe structure of elongated electrical conductors projecting from a support structure," which highlights a design utilizing a plurality of insulated elongated electrical conductors. This design is particularly adept at testing electrical interconnections for integrated circuit devices with rigid interconnection pads and high-density interconnection pads. Additionally, another patent titled "Probe structure having a plurality of discrete insulated probe tips projecting from a support surface" further expands on this technology, detailing methods for their fabrication and functionality. Together, these inventions underscore Liao's dedication to enhancing the efficiency and effectiveness of electrical testing methodologies.

Career Highlights

Throughout his career, Liao has been associated with prominent companies, including IBM and Globalfoundries Inc. His tenure at these innovative firms has enabled him to collaborate on ground-breaking projects, contributing significantly to advancements in semiconductor technologies and beyond.

Collaborations

Yun-Hsin Liao has worked alongside distinguished colleagues such as Da-Yuan Shih and Marie Angelopoulos, fostering collaborative efforts that have played a crucial role in his research and innovation journey. Their shared expertise has undoubtedly enhanced the development and implementation of Liao's inventions.

Conclusion

Yun-Hsin Liao stands out as a pioneering inventor whose work continues to influence the realm of electrical probing technologies. With 20 patents to his name and a flourishing career supported by collaborations with notable professionals and institutions, Liao's contributions will likely resonate within the tech industry for years to come. His ongoing innovations promise to shape the future of electronic testing and interconnectivity, making him a key figure in modern invention.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]