International Business Machines Corporation

Globalfoundries Inc.

Yun-Hsin Liao

Marie Angelopoulos

Da-Yuan Shih

Keith E Fogel

Paul Alfred Lauro

Ravi F Saraf

Brian Samuel Beaman

Daniel Peter Morris

James L Hedrick

Robert Dennis Miller

Jeffrey Curtis Hedrick

Jons Gunnar Hilborn

Coaxial probe structures include a plurality of discrete insulated elongated electrical conductors projecting from a support surface which are useful as probes for testing of electrical interconnections to electronic devices, such as integrated circuit devices and other electronic components and particularly for testing of integrated circuit devices with rigid interconnection pads and multi-chip module packages with high density interconnection pads. Coaxial probe structures are fabricated by the methods described providing a high density coaxial probe.

Coaxial probe structure of elongated electrical conductors projecting from  a support structure

Structures having a plurality of discrete insulated elongated electrical conductors projecting from a support surface which are useful as probes for testing of electrical interconnections to electronic devices, such as integrated circuit devices and other electronic components and particularly for testing of integrated circuit devices with rigid interconnection pads and multi-chip module packages with high density interconnection pads and the apparatus for use thereof and to methods of fabrication thereof. Coaxial probe structures are fabricated by the methods described providing a high density coaxial probe.

Probe structure having a plurality of discrete insulated probe tips projecting from a support surface, apparatus for use thereof and methods of fabrication thereof

The present invention is directed to structures having a plurality of discrete insulated elongated electrical conductors projecting from a support surface which are useful as probes for testing of electrical interconnections to electronic devices, such as integrated circuit devices and other electronic components and particularly for testing of integrated circuit devices with rigid interconnection pads and multi-chip module packages with high density interconnection pads and the apparatus for use thereof and to methods of fabrication thereof. Coaxial probe structures are fabricated by the methods described providing a high density coaxial probe.

Redox method of forming a coaxial probe structure of elongated electrical conductors projecting from a support structure

Electrodeposition method of forming a probe structure having a plurality of discrete insulated probe tips projecting from a support surface

Methods of forming materials containing precursors to electrically conductive polymers and electrically conductive polymers are described which have a high degree of crystallinity. The high degree of crystallinity is achieved by preparing the materials under conditions which provide a high degree of mobility to the polymer molecules permitting them to associate with one another to form a crystalline state. High levels of electrical conductivity are achieved in in the electrically conductive materials without stretch orienting the material. The enhanced electrical conductivity is isotropic as compared to a stretch oriented film which has isotropic electrical conductivity. In the preferred embodiment, additives are added to a solution containing a solvent and the precursor or electrically conductive polymer. The additives are preferably plasticizer of diluents. As the solvent is removed the material dries and contains a higher degree of crystallinity than in the absence of the additive.

Methods of fabricating plasticized, antiplasticized and crystalline conducting polymers and precursors thereof

The present invention is directed to methods of solvating electrically conducting polymers and electrically conducting polymers by processing these materials in selected solvents comprising at least one of the solvents being a fluorinated solvent. High solubility and conductivity in the hundreds of S/cm are achieved by these methods. Excellent coatings are attained. These materials have application in EMI shielding, electrodes for displays, contacts for devices, ESD protection, corrosion protection and resists.

Methods of processing and synthesizing electrically conductive polymers and precursors thereof to form electrically conductive polymers having high electrical conductivity

Materials containing precursors to electrically conductive polymers and electrically conductive polymers are described which have a high degree of crystallinity. The high degree of crystallinity is achieved by preparing the materials under conditions which provide a high degree of mobility to the polymer molecules permitting them to associate with one another to form a crystalline state. High levels of electrical conductivity are achieved in the electrically conductive materials without stretch orienting the material. The enhanced electrical conductivity is isotropic as compared to a stretch oriental film which has isotropic electrical conductivity.

Plasticized, antiplasticized and crystalline conducting polymers and precursors thereof

The present invention is directed to structures having a plurality of discrete insulated elongated electrical conductors projecting from a support surface which are useful as probes for testing of electrical interconnections to electronic devices and other electronic components and particularly for testing of integrated circuit devices with rigid interconnection pads and multi-chip module packages with high density interconnection pads and the apparatus for use thereof and to methods of fabrication thereof. Coaxial probe structures are fabricated by the methods described providing a high density coaxial probe.

Probe structure having a plurality of discrete insulated probe tips

The present invention is directed to a polymer selected from a precursor to an electrically conductive polymer and an electrically conductive polymer. The polymer has a branched structure. The polymer is formed from polymerization of momomers of which at least one monomer has more than one polymerizable site. One of the polymerizable monomers or units can have structural formula X&mdash;(M),where X is a base element of the unit, M is the polymerization functional site, n is the number of M sites; and n>1. The polymer can be formed from more than one polymerization unit having different base elements, polymerization functional units and different values of n.

Branched electrically conductive polymers and precursors and applications thereof

Polycrystalline materials containing crystallites of precursors to electrically conductive polymers and electrically conductive polymers are described which have an adjustable high degree of crystallinity. The intersticial regions between the crystallites contains amorphous material containing precursors to electrically conductive polymers and/or electrically conductive polymers. The degree of crystallinity is achieved by preparing the materials under conditions which provide a high degree of mobility to the polymer molecules permitting them to associate with one another to form a crystalline state. This is preferable achieved by including additives, such as plasticizers and diluents, to the solution from which the polycrystalline material is formed. The morphology of the polycrystalline material is adjustable to modify the properties of the material such as the degree of crystallinity, crystal grain size, glass transition temperature, thermal coefficient of expansion and degree of electrical conductivity. High levels of electrical conductivity are achieved in the electrically conductive polycrystalline materials without stretch orienting the material. The enhanced electrical conductivity is isotropic as compared to a stretch oriented film which has isotropic electrical conductivity.

Polycrystalline conducting polymers and precursors thereof having adjustable morphology and properties

The present invention is directed to a new foamed elastomer composition including elastomer, hollow fillers, and reinforced fillers for supporting the conducting wires in the test probes for wafer level testing and burn in and interposer connector applications. The thermally stable elastomer resin is mixed with hollow fillers and reinforced fillers before filling into the probe or connector mold with an array of elongated conducting wires, then is crosslinked by a crosslinking agent and a catalyst. The use of compressible hollow fillers to foam the elastomer has been successful to enhance the compliance and resilience, and to reduce the thermal expansion, density, and dielectric constant of the elastomer.

Foamed elastomers for wafer probing applications and interposer

Methods of fabricating plasticized, antiplasticized and crystalline

The present invention is directed to a method for fabricating a polymer selected from a precursor to an electrically conductive polymer and an electrically conductive polymer. The polymer has a branched structure. According to the present invention the branched polymer is formed from polymerization of monomers of which at least one monomer has more than one polymerizable site. One of the polymerizable monomers or units can have structural formula X--(M).sub.n where X is a base element of the unit, M is the polymerization functional site, and n is the number of M sites; n&gt;1. The polymer can be formed from more than one polymerizable unit having different base elements, polymerization functional sites and different values of n.

Growing community of inventors

Tempe, AZ, United States of America

Yun-Hsin Liao