The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 23, 2013

Filed:

Aug. 21, 2009
Applicants:

Brian Samuel Beaman, Apex, NC (US);

Keith Edward Fogel, Mohegan Lake, NY (US);

Paul Alfred Lauro, Nanuet, NY (US);

Yun-hsin Liao, Tempe, AZ (US);

Daniel Peter Morris, Purchase, NY (US);

Da-yuan Shih, Poughkeepsie, NY (US);

Inventors:

Brian Samuel Beaman, Apex, NC (US);

Keith Edward Fogel, Mohegan Lake, NY (US);

Paul Alfred Lauro, Nanuet, NY (US);

Yun-Hsin Liao, Tempe, AZ (US);

Daniel Peter Morris, Purchase, NY (US);

Da-Yuan Shih, Poughkeepsie, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B05D 5/12 (2006.01); C23C 18/28 (2006.01); C23C 18/40 (2006.01); C23C 28/02 (2006.01); C25D 7/00 (2006.01); G01R 1/073 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention is directed to structures having a plurality of discrete insulated elongated electrical conductors projecting from a support surface which are useful as probes for testing of electrical interconnections to electronic devices, such as integrated circuit devices and other electronic components and particularly for testing of integrated circuit devices with rigid interconnection pads and multi-chip module packages with high density interconnection pads and the apparatus for use thereof and to methods of fabrication thereof. Coaxial probe structures are fabricated by the methods described providing a high density coaxial probe.


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