This inventor holds 2 USPTO granted patents and 2 published patent applications. Top assignee: Advanced Semiconductor Engineering, Inc.. Active years: 2022-2023.
Company Filing History:
Years Active: 2022-2023
Title: Innovations of Yun-Ching Hung in Semiconductor Technology
Introduction
Yun-Ching Hung is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on innovative semiconductor packages that enhance performance and efficiency.
Latest Patents
Yun-Ching Hung's latest patents include advancements in semiconductor packages. The first patent describes a semiconductor package that features a first substrate, a first flow channel, and a second flow channel. The design allows for fluid communication between the channels while maintaining a bonding region on the substrate. The second patent outlines a semiconductor package that consists of a first substrate with a trench and a second substrate facing it. This design includes a pathway cavity defined by the trenches, which incorporates metal and insulating protrusions, along with a method for manufacturing the package.
Career Highlights
Yun-Ching Hung is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to innovate in semiconductor technology. His expertise and contributions have positioned him as a key figure in the industry.
Collaborations
Yun-Ching has collaborated with several talented individuals, including Yung-Sheng Lin and An-Hsuan Hsu, who contribute to the dynamic environment of innovation at their workplace.
Conclusion
Yun-Ching Hung's work in semiconductor technology exemplifies the spirit of innovation and dedication to advancing the field. His patents reflect a commitment to improving semiconductor packaging, which is crucial for modern electronic devices.