Yuichi Wada

Title: Yuichi Wada: Innovator in Semiconductor Technology

Introduction

Yuichi Wada is a prominent inventor based in Kofu, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 5 patents. His innovative approaches have paved the way for advancements in multilevel interconnection methods.

Latest Patents

One of Yuichi Wada's latest patents is a multilevel interconnection forming method for semiconductors. This method involves depositing a metal film containing aluminum on an insulating film of a substrate. The metal film is then patterned to create a wiring layer of the first layer. An interlayer dielectric film is formed over the entire surface of the substrate, covering the wiring layer. A hole is created at a predetermined position in the interlayer dielectric film, reaching the wiring layer. Aluminum is selectively deposited into the hole using a CVD method, ensuring a volume ratio smaller than 100%. An active metal film is formed on the upper surface of the interlayer dielectric film, and a metal layer containing aluminum is created on the active metal film. The metal layer is then reflowed to fill the hole completely and to planarize the surface, followed by patterning to form a wiring layer of the second layer.

Career Highlights

Throughout his career, Yuichi Wada has worked with notable companies such as Tel-Varian Limited and Tokyo Electron Limited. His experience in these organizations has contributed to his expertise in semiconductor technologies and innovations.

Collaborations

Yuichi Wada has collaborated with esteemed colleagues, including Hiroshi Kobayashi and Jiro Katsuki. Their joint efforts have further advanced the field of semiconductor technology.

Conclusion

Yuichi Wada's contributions to semiconductor technology through his innovative patents and collaborations highlight his role as a key inventor in the industry. His work continues to influence advancements in this critical field.