Yue-Ying Jian

Title: Innovations of Yue-Ying Jian in Semiconductor Technology

Introduction

Yue-Ying Jian is a notable inventor based in Nantou County, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of three patents. His work focuses on advanced processes that enhance the efficiency and effectiveness of semiconductor devices.

Latest Patents

One of Yue-Ying Jian's latest patents is the Fluxless Bumping Process. This innovative process involves providing a semiconductor device that includes a bond pad and an under bump metallurgy overlying the bond pad. It further includes forming a solder structure over the under bump metallurgy, where the solder structure features an outer layer made of tin oxide. The process also entails producing a plasma from at least one of CF and SF gases and exposing the solder structure to this plasma. Finally, the solder structure is heated and cooled to create a solder bump on the semiconductor device.

Career Highlights

Yue-Ying Jian is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His expertise and innovative approaches have contributed to the company's reputation for excellence in semiconductor manufacturing.

Collaborations

Yue-Ying Jian has collaborated with several talented individuals in his field, including Chao-Yuan Su and Chia-Fu Lin. These collaborations have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Yue-Ying Jian's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the industry. His innovative processes continue to shape the future of semiconductor manufacturing.